Symposium  /  January 30, 2019

Panel Level Packaging in Dresden and Berlin

Almost 100 participants came together for the fourth Symposium on »Status & Trends in Panel Level Packaging« at the Hilton Hotel in Dresden on Jan. 30, 2019. The meeting was a post event of the 3D & Systems Summit.

International experts from industry and science presented the latest research results from this exciting new manufacturing technology, including:

  • Market and application trends
  • Latest technology results for PLP
  • Material, equipment and process developments for large area and fine line processing
  • Cost analysis


  Presenter Title
Dr. YoungGwan Ko, SAMSUNG Electro-Mechanics Co.Ltd.
The FOPLP of Samsung & Beyond Moore
14:30 Michael Töpper, Fraunhofer IZM How Fine Line Wiring Influences the Cost of Panel Level Packaging (PLP)
15:00 Dr. Andreas Plößl, Osram
Opportunities of Panel-Level Packaging for LED-Fabrication
15:30 Hiroyuki Sakauchi, Ajinomoto Advanced Insulating Film Materials for Fan-out application
16:00 Coffee Break  
16:30 Roland Rettenmeier, Evatec Evatec's all-in-one FanOut process for organic substrates
17:00 Yuki Nakata, Meltex The wet etching and stripping technology for Fan-Out Panel Level Packaging
17:30 Jan Vardaman, TechSearch
The Fan-Out Panel Option:  Where Does it Fit?
18:00 End  
19:00 Evening Event “Sophienkeller”