Manufacturing & Prototyping

A qualified electroless bumping technology is available at the Fraunhofer IZM. Electroless Ni bumps have shown excellent suitability in various flip chip products. They are used as UBM (under bump metallization) for eutectic solder as well as for lead-free and high temperature solder.

Solder bumps with electroless Ni UBM meet all reliability requirements of automotive products. Furthermore, Ni bumps can be used in flip chip adhesive joining like COG (chip on glass) assembly using ACA (anisotropic conductive adhesive). Due to the low cost of Ni bumping, it is of special interest for smart cards and smart labels.