Wafer Level System Integration

Wafer Level System Integration

The department "Wafer Level System Integration" (WLSI) develops advanced packaging and system integration technologies and offers customer-specific solutions for microelectronic products in the overall scope of smart system integration. Approx. 60 scientists work at two locations: Berlin and Dresden (ASSID: All Silicon System Integration Dresden). WLSI is cooperating globally with manufacturers and users of microelectronic products as well as cleanroom equipment producers and material developers from the chemical industry.

2.5/3D Technologies

  • TSV Integration
  • Silicon interposer TSV first
    • TSV via middle
    • TSV via last
    • Device stack

High Density Redistribution




  • Back grinding tape lamination
  • Wafer backgrinding
  • Polishing
  • mechanical blade dicing
  • laser grooving
  • laser stealth dicing
  • wafer edge trimming

High-Density Assembly

  • Fine pitch assembly for pixel detectoren
  • Interconnect metallurgy and processes
  • Thermo compression bonding
  • Chip-Stacking
  • Fine-pitch flip chip (FC) assembly & die bonding
  • Wafer-level solder ball attach (100 – 500 μm)
  • Evaluation of low-temperature assembly technologies
  • Evaluation of flux free solder connections with self alignment capability
  • Reliability investigation of flip chip interconnections

Failure Analysis & Reliability Investigation

  • Metrology: Bump heights / TSV depth measurement, defect inspection, topology, layer thickness, wafer thickness & bow/ warp (VIS), wafer thickness (infrared), die warpage measurement, physical failure analysis, preparation techniques 3D stack
  • FIB / REM imaging

Sensor Development

  • Sensor design
  • Reliability and lifetime optimization
  • Standard and customer-specific packaging with integrated sensor data processing e.g. TO8,  packages with  media separation, molding
  • Characterization of pressure (10 m-100 Bar), gas and acceleration sensors (up to 40 g)
  • Planar technologies (SiO, SIN deposition, Sputtering)
  • Overview sensor activities

The department WLSI has cleanrooms and laboratories with production-compatible equipment available at both sites. Beside the flexibility regarding the processing of different wafers sizes, both process lines are also  characterized by a high adaptability of the individual processes. The process line at ASSID is particularly tailored to realize production-related and industry-compatible development and processing.

Overview Equipment



Upcoming Events

Meet Fraunhofer IZM and its department WLSI at the following events:

MikroSystemTechnik Kongress

Oct. 28.-30, 2019, Berlin, Germany
Presentations & Exhibition



WLSI completely ISO 9001:2015 certified !

Since May 2018, the department WLSI is holding the ISO 9001:2015 certificate for both its sites - in Berlin and Dresden.

The department has thus completed the process of adjusting it's complete management processes to fulfill the strict requirements of the cerfification after the WLSI part ASSID set a good example in 2015 when it first received the ISO 9001 certificate for its site in Dresden.



Kai Zoschke and his Co-Authors received the "Best Academic Award"of the Electronics Packaging Technology Conference (EPTC) for their paper "Full Wafer Redistribution and Wafer Embedding as Key Technologies for a Multi-Scale Neuromorphic Hardware Cluster" which was presented during the 2017 conference.




Thee 2017 edition of the annual International Wafer Level Packaging Conference in San Jose, CA, has recognized the work of Dr. Wolfram Steller with not one, but two Best Paper Awards: „Best of Conference Paper“ and„Best of 3D Track Paper“ for his paper "Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter".




The Fraunhofer Cluster 3D Integration wins the “2016 3D InCites Awards for Excellence in 3D Packaging Technologies” in the category “Research Institute of the Year". The award was presented on July 12th, 2016 in San Francisco.  



Research Network "Functional Integration in Micro and Nanoelectronics"

Fraunhofer, TU Dresden and TU Chemnitz cluster their competencies in the fields of micro / nano electronics. Research know-how will – in close cooperation with resident companies – be extended and innovations can be implemented more  quickly into applications and products.  

More Information

Overview Contact Persons

Quickly find the right expert for your question & request.


WLSI is involved in a lot of national and international projects. An excerpt of these will show you our expertise and achievements.



WLSI is regularly presenting latest research results at conferences and exhibitions. Have a closer look at some Exhibits.

Brochures and Presentations

Find brochures for your general or specific information.

ISO 9001

Since 05/2015 the department part “ASSID” in Moritzburg is working with a ISO 9001 certified management system to guarantee high quality standards.

Furthermore, in May 2018, the WLSI department part in Berlin has also received the ISO 9001:2015 certificate.


Corporate Video IZM-ASSID