Wafer Level System Integration

With respect to the requirements of future microelectronic systems, 3D integration plays an important role for heterogeneous system integration - meaning the integration of different multi-functional components in one package.

Wafer Level System Integration

The department "Wafer Level System Integration" (WLSI)  specializing in developing advanced packaging and system integration technologies thus being able to offer customer-specific solutions for microelectronic products in the overall scope of smart system integration.

Within the department approx. 60 scientists work at these topics at two locations: Berlin and Dresden (All Silicon System Integration Dresden (IZM-ASSID)).

The department offers prototyping, small-volume production and a broad spectrum of R&D services to partners and customers. In numerous R&D projects, ongoing skills and know-how are continuously being developed which can be passed to SME-partners on a development stage. WLSI has also established a broad cooperation network with manufacturer and users of microelectronic products as well as with cleanroom equipment producers and material developers from the chemical industry from all over the world.

The department "Wafer Level System Integration" (WLSI)  focuses its research activities on technologies for wafer level system integration and packaging which are exclusively related to wafer processing. To cover a broad range of research aspects, the department WLSI is actively working in six major research areas.

For further information use the list below to directly enter your topic of interest.

Fraunhofer IZM established itself as a competent network, cooperation & service partner. R&D services for customers include process development, material evaluation and qualification, prototyping, low-volume manufacturing as well as process and technology transfer. Newly developed technologies are individually adapted to customer-specific requirements.

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The department WLSI has cleanrooms and laboratories with production-compatible equipment available at both sites. Beside the flexibility regarding the processing of different wafers sizes, both process lines are also  characterized by a high adaptability of the individual processes. The process line at ASSID is particularly tailored to realize production-related and industry-compatible development and processing.

Overview Equipment



Upcoming Events

Meet Faunhofer IZM and its department WLSI at the following events:

European 3D Summit
January 22-24, 2017, Dresden




The Fraunhofer Cluster 3D Integration wins the “2016 3D InCites Awards for Excellence in 3D Packaging Technologies” in the category “Research Institute of the Year". The award was presented on July 12th, 2016 in San Francisco.  



Research Network "Functional Integration in Micro and Nanoelectronics"

Fraunhofer, TU Dresden and TU Chemnitz cluster their competencies in the fields of micro / nano electronics. Research know-how will – in close cooperation with resident companies – be extended and innovations can be implemented more  quickly into applications and products.  

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Overview Contact Persons

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WLSI is involved in a lot of national and international projects. An excerpt of these will show you our expertise and achievements.



WLSI is regularly presenting latest research results at conferences and exhibitions. Have a closer look at some Exhibits.

Brochures and Presentations

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ISO 9001

Since 05/2015 the department part “ASSID” in Moritzburg is working with a ISO 9001 certified management system to guarantee high quality standards.


Corporate Video IZM-ASSID