Key Research Area

Power Electronics and Packaging Development

By adapting the packaging technology used, power electronic systems can be optimized for customer requirements. Our research group’s system development also addresses packaging questions. We select the appropriate packaging for individual customer applications or develop the design from scratch if necessary. Our group cooperates on innovative packaging projects with other departments, and tests and qualifies converters. We draw on extensive know-how in materials, design, thermal management and joining techniques such as soldering, sintering and wire bonding.

Electrical testing and qualification of the systems developed at the institute is performed in the department’s state-of-the-art laboratory.

Projects relating to Power Electronics and Packaging Development


Ultra-compact power module of the highest reliability


Ultra-compact, ultra-reliable power module


Electrical rotor hub actuator

Low Inductance

Packages for Fast-Switching Semiconductors

Advanced Driver by Fraunhofer IZM

Miniaturized Zero Dead Time High Efficiency Driver for Si, SiC and GaN Applications