Key Research Areas

Packaging technologies for bioelectronics

Technologies for Bioelectronics
© Fraunhofer IZM

For more than half a century hermetic cases made of hard materials, such as titanium or ceramics, have been the number one choice for packaging of implantable electronic devices. However in order to maintain safe, reliable contact with tissue the implanted device should be soft like the tissue itself. For these reasons, the Technologies for Bioelectronics Group investigates a variety of non-hermetic packaging solutions for implantable electronic devices including:

  • Thermoplastic Polyurethane
  • Parylene C in combination with thin ceramics (Al2O3 & TiO2) deposited via atomic layer deposition
  • PDMS

These options allow us to package components and systems with a variety of different form-factors.


Working Group

Technologies for bioelectronics

We design and fabricate active neural interfaces.