Analytics is an essential component for the verification of microelectronic systems. It is used for quality control, fault analysis, material characterization, process optimization, and reliability assessment. Non-destructive analytics without prior sample preparation utilize light, X-ray, and low-vacuum scanning electron microscopes. For three-dimensional volume examinations, Micro X-ray Computed Tomography (Micro-XCT) is used. High-resolution analysis is made possible by cross-sectioning, which is examined using light and scanning electron microscopes (in high vacuum). Additionally, ion beam techniques (focused ion beam = FIB) can be employed for target preparation in the micrometer range. Energy-dispersive X-ray spectroscopy (EDX) is used to determine the elements present in the sample.