Fraunhofer Institute for Reliability and Microintegration IZMWe develop and qualify packaging technologies on flexible substrates. Our research focuses on adhesive bonding and soldering of bare dies. We have many years of experience in material selection, process development and reliability assessment for ACA, NCA and ICA flip-chip bonding on various substrate materials. New approaches in nanostructure technology are also being investigated, including their potential for new low-temperature interconnection technology. Over recent years, we have also begun developing and evaluating emerging technologies for the integration of electronics in textiles.
- Ultra-thin flip-chip interconnections
- Thermoplastic substrates
- Electronics in textiles