Flexible substrates are a key component in changing the way we interact with and use electronic devices. Unlike traditional rigid printed circuit boards, flexible electronics can be bent, twisted, and shaped to fit different form factors, making them ideal for applications where flexibility is crucial. Based on customer requirements or layouts, flexible printed circuit boards can be manufactured using various materials and structuring technologies. The substrate line at IZM enables the production of flexible substrates in sheet sizes up to 60 x 40 cm2. In addition to polyimide as a typical substrate material, thermoplastic materials (TPU, PC, LCP) are increasingly being used, as well as materials that are particularly suitable for medical applications (e.g., Parylene, LCP). Subtractive and semi-additive patterning processes are available for copper conductive traces, allowing for 10 µm lines/space to be achieved. Research and development activities are ongoing to achieve even finer structures. Alternative metallizations (e.g., Au) are also possible. In the field of printed electronics, customer circuits can be implemented. Commercially available pastes and inks are structured on various film materials (PET, PC, LCP, thin glass, paper, etc.) using screen printing or inkjet printing.