Manufacturing & Prototyping

Assembly of microelectronic components on flexible & rigid substrates

tsr-2 PU-based acoustrode / PU-basierte Akustrode
© Fraunhofer IZM

Embedded ICs enable the addition of intelligence and the miniaturization of standalone electronic devices. The Technologies for Bioelectronics group offers bonding solutions for the biocompatible integration of microelectronic components including thinned chips.

  • Chip to Wafer & Chip to Flex Assembly
  • Thermosonic Bonding
    • Up to 300 N
  • Flip chip
  • Stamping
  • Flux Dipping
  • Dispensing
  • UV Curing
  • Pick & Place

Different approaches are required for different components and materials, to discuss the best option for your needs feel free to contact us!


Working Group

Technologies for Bioelectronics

We design and fabricate active neural interfaces.