Fraunhofer Institute for Reliability and Microintegration IZMAssembly of microelectronic components on flexible & rigid substrates
Embedded ICs enable the addition of intelligence and the miniaturization of standalone electronic devices. The Technologies for Bioelectronics group offers bonding solutions for the biocompatible integration of microelectronic components including thinned chips.
- Chip to Wafer & Chip to Flex Assembly
- Thermosonic Bonding
- Up to 300 N
- Flip chip
- Stamping
- Flux Dipping
- Dispensing
- UV Curing
- Pick & Place
Different approaches are required for different components and materials, to discuss the best option for your needs feel free to contact us!