Embedded silicon carbide ready for mass production in e-mobility
© Fraunhofer IZM | Volker Mai
Embedded silicon carbide ready for mass production in e-mobility

Silicon carbide semiconductors, packaged for high-temperature applications, have the potential to increase switching frequencies and output substantially in future power electronics, while making them less susceptible to failure. This requires robust packaging and interconnection technologies, which the SiCmodul project was set up to develop. The research efforts focus on scalable modular power electronics (drive inverter) for use in electric vehicles at temperatures ranging up to 200° centigrade. With this degree of heat resistance, the inverters can be placed immediately on the engine, allowing more compact and efficient electric motor designs.

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Project Partners

  • Robert Bosch GmbH
  • Conti Temic microelectronic GmbH
  • Schweizer Electronic AG
  • ISEA Institut für Stromrichter und elektrische Antriebe
  • AixControl GmbH, TLK-Thermo GmbH
  • Daimler AG (assoziert)

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