From September 16 to 18, 2025, Fraunhofer IZM participated in the European Microelectronics & Packaging Conference (EMPC) in Grenoble. Numerous Fraunhofer IZM researchers presented the latest research results in the field of microelectronic packaging at the EMPC.

The day before the conference began, Ivan Ndip, Tanja Braun, and Markus Wöhrmann led short courses. Institute Director Ulrike Ganesh delivered a keynote titled "Advanced Packaging: The Key Technology for Chiplet Integration." This presentation was supplemented by additional technical contributions and an exhibition booth.