CIPS - International Conference on Integrated Power Electronics Systems

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

Intelligent electronic systems – available everywhere and to everyone! In order to make this possible, components need to have exceptional properties. Depending on the application, they need to function reliably at high temperatures, be extremely miniaturized and moldable to individual build spaces or even flexible.

Fraunhofer IZM helps companies around the world develop and assemble robust and reliable electronics to the very cutting edge and then integrate them into the required application. To this end Fraunhofer IZM develops adapted system integration technologies on wafer-, chip- and board level. Our research continues to improve reliability and helps customers confidently predict a product’s lifetime.

At CIPS 2026 we will be showcasing Fraunhofer IZM’s expertise in the realms of system design, advanced packaging concepts and reliability and test for power electronics.