Events

The European Microelectronics & Packaging Conference (EMPC) is one of the two leading European conferences in the field of microelectronic packaging and interconnection technology. The 25th edition will take place from September 16 to 18, 2025, at the World Trade Center in Grenoble, France—in the heart of one of Europe's most innovative high-tech regions.

Fraunhofer IZM will be represented at EMPC this year by numerous researchers who will present the latest research results in the field of microelectronic packaging in lectures, courses, and a keynote speech.  Ivan Ndip, Tanja Braun, and Markus Wöhrmann will give short courses on the day before the conference, and Institute Director Ulrike Ganesh will contribute a keynote speech on “Advanced Packaging – The Key Technology for Chiplet Integration.”

If you are also in Grenoble, come and visit us at our booth #49!