Events

In 2018 Fraunhofer IZM will again be presenting at PCIM (Power Conversion Intelligent Motion) Europe. The world’s leading trade fair for power electronics, intelligent motion, renewable energy and energy management takes place in Nürnberg.

Fraunhofer IZM will be presenting its entire range of services from in the realm of power electronics at PCIM 2018 – covering everything from system design and packaging technologies for power electronics up to reliability aspects and cooling concepts.

We look forward to meeting you in Hall 7, booth 349!

Tuesday, 05.06.2018, 11:00 - 12:40

High Temperature Encapsulation for Smart Power Devices

Research is presented, that provides a detailed description of the high temperature suitability of encapsulants for power electronics encapsulation ? additionally an extended test methodology is described to facilitate future material evaluation for HT or harsh environment use of polymeric materials as encapsulants or base materials is described.

more info (mesago.de)

Tuesday, 05.06.2018, 15:15 - 17:30

Wafer Level Embedding Technology for Packaging of Planar GaN Half-Bridge Module in High Power Density Conversion Applications

A new fabrication process is presented for packaging of GaN bare devices in form of silicon-based packages using wafer level back-end processes. Compact planar half-bridge modules were fabricated at 200 mm wafer scale with 650 V rated single GaN bare die. The package demonstrates voltage breakdown up to 650 V with leakage current as low as 250 nA and thermal resistance RthJC of around 0.4 K/W. Implementation in power solutions has been first evaluated and results will be presented.

more info (mesago.de)