SEMICON Europa is the largest exhibition in Europe for semiconductor, MEMS and photovoltaic equipment, materials and service suppliers. This year the fair will be taking place in Munich from November 12-15, 2018, concurrent with electronica.

Together with other Fraunhofer Institutes from the Microelectronics Alliance Fraunhofer IZM will be presenting its latest developments from the realm of panel and wafer level packaging technologies at the booth of the Research Fab Microelectronics Germany (FMD).

The focus is on:

  • Wafer level MEMS packaging
  • Panel level packaging
  • Wafer-to-wafer bonding
  • Flexible multi-layer HD substrates
  • Silicon interposers
  • Through silicon vias
  • High-density redistribution
  • Wafer thinning

Fraunhofer IZM’s ASSID group (All Silicon System Integration Dresden) will be presenting its activities in 3D wafer level packaging and wafer stacking at the booth of Silicon Saxony, #B1221