Symposium  /  November 27, 2018

Status & Future of Electronic Packaging

This year, Fraunhofer IZM is celebrating its silver anniversary. Since its foundation in 1993, the institute has become a world leader in the development of innovative microelectronic packaging and miniaturization technologies for a wide range of applications.

To celebrate 25 years of excellent research, we are holding an International Symposium titled “Status & Future of Electronic Packaging” on November 27, 2018. Renowned microelectronics experts and key stakeholders from around the world are being invited to highlight major technological trends and innovations in areas such as wafer level packaging, system-in-package, sensor applications, automotive electronics, and medical devices.

The Symposium will be followed by a formal event, with a brief welcoming address of the Governing Mayor’s Senate Chancellery of Berlin, the Federal Ministery for Research and Education, and the President of the Fraunhofer-Gesellschaft.