Milestones in Microsystem Technology - The History of Fraunhofer IZM

Fraunhofer IZM has enjoyed a very successful track record since its founding in 1993. Over 400 employees research and develop microsystem technology at the three Fraunhofer IZM branches, located in Berlin, Dresden and Cottbus.


  • The Research Fab Microelectronics Germany, four Fraunhofer Institutes, the Forschungszentrum Jülich and AMO GmbH launched the "Research Fab Microelectronics Germany - Quantum and Neuromorphic Computing Module" on 1 December 2022 | more info
    New equipment in the field of quantum photonics at Fraunhofer IZM | more info
  • Opening of cryo lab
    Fraunhofer IZM develops integration technologies for cryo-electronics | more info
  • New semiconductor research center opened in Dresden
    With Fraunhofer IZM-ASSID and Fraunhofer IPMS, Center Nanoelectronic Technologies CNT, two unique research institutions in the field of microelectronics are located in Saxony. They are now the only two German research centres for applied microelectronics research based on 300 mm wafer industry-standard equipment. | more info


  • Opening of the Textile Prototyping Lab (TPL)
    Germany's first open laboratory for prototyping textile electronics has been opened at Fraunhofer IZM together with the weißensee kunsthochschule Berlin. Equipped with state-of-the-art technology, e-textile ideas can now be developed and realized in the Textile Prototyping Lab (TPL) with an interdisciplinary team from science and art. | more info
  • Launch: The Research Fab Microelectronics (FMD) goes into regular operation | more info
  • Expansion: Cooperation between the Centre Nanoelectronic Technologies (CNT) and the Fraunhofer IZM-ASSID.


  •  Launch of the second Panel Level Packaging (PLC 2.0) consortium
    The second consortium is focusing on die placement and embedding technology for ultra-fine line wiring down to 2 µm line width and a potential of down to 1 µm. Research into migration effects and the migration limits of fine line wiring are further tasks of the project. Once again, 17 industrial partners are involved in this international co-operation. | more info
    Fraunhofer IZM's special expertise in wafer-level packaging and substrate development formed the basis of the first panel-level packaging consortium in 2016, in which a total of 17 industrial partners were able to participate. The international consortium fulfilled its most important projects and made enormous progress in large-format fan-out panel-level packaging
  •  Start of the expansion of the Center Nanoelectronic Technologies (CNT) in a cooperation between the Fraunhofer Institute for Photonic Microsystems IPMS and Fraunhofer IZM-ASSID.


Fraunhofer IZM opens a branch office in Cottbus. The main focus of the branch office is on high-frequency sensor systems, while its research activities concentrate on design, testing and characterization of integrated antennas, co-design of chip package antennas as well as system integration solutions for the realization of miniaturized high-frequency sensor systems. | more info


  • IZM celebrates 25th anniversary!
  • Testimonials



  • Launch of the Panel Level Packaging Consortium (more info)


  • Opening of the new research and development center "AdaptSys - Multifunctional Microelectronics for Innovative Micro- and Nano-Integration Technology in the Development of Application-Oriented Systems"


  • Launch of the Berlin substrate line and molding laboratory.


  • The reliability laboratory “Electronics Condition Monitoring” (ECM) opens in Berlin


  • The Chemnitz branch is established as the independent institute Fraunhofer ENAS


  • SecurityLab Berlin opens in a joint initiative with the Bundesdruckerei GmbH for the development of intelligent security documents.
  • The Teltow branch becomes the independent institute Fraunhofer PYCO.
  • The research focus “Multi-Functional On-Top Technologies” is intensified in a cooperation with the Universität der Bundeswehr in Munich.


  • The “Smart System Integration” Application Center is established in Berlin to help companies new to microsystem technology with product development and the integration of microelectronics.


  • The Munich-based Fraunhofer Institute for Solid State Technology, with the departments Vertical System Integration, Polytronic Systems, Advanced Testing of Integrated Systems and Micro Actuators and Fluidics, is fully merged into Fraunhofer IZM.


  • The Micro Mechatronic Center in Oberpfaffenhofen opens


  • The Center for Microsystem Technology, a joint initiative by leading Berlin-based microsystem technology research institutes is established at the Berlin-Adlershof Science and Technology Park. Fraunhofer IZM contributes its expertise in system integration and reliability to the center.


  • Part of the Munich-based Fraunhofer Institute for Solid State Technology is merged as department into Fraunhofer IZM with the research focus “Pervasive Computing System Technologies”.


  • Polymer materials and composites is added to the institute’s research portfolio. The new department is located at a separate branch in Teltow (Brandenburg).
  • In Paderborn, the project group Advanced System Engineering is established in cooperation with the local university.
  • A department dedicated to the topic is established in Chemnitz.


  • Due to its success in industry and science, Fraunhofer IZM is granted the status of institute and is thus wholly established within the Fraunhofer-Gesellschaft.


  • Merging of the Training Center for Interconnection Technologies (ZVE) with Fraunhofer IZM. ZVE augments Fraunhofer IZM’s training program and reinforces its expertise in SMT component qualification and analysis.


  • Founding of the Fraunhofer Institute for Reliability and Microintegration IZM with 21 employees from research groups at the TU Berlin, Humboldt-Universität and since closed Institute for Mechanics at Academy of the Sciences in Chemnitz.
  • http://www.becap.tu-berlin.de, thereafter ongoing close collaboration between staff and on research foci.