Event Review SMT

System Integration in Micro Electronics

Fraunhofer IZM at SMT 2017

On May 16th, SMT Hybrid Packaging, Europe’s leading exhibition for system integration in electronics, opened its gates to crowds of interested visitors. The Fraunhofer IZM naturally attended in force to show its newest developments in mounting and interconnect technology.

One of the greatest draws at the exhibit was a set of LED modules using innovative flip-chip technology. Designed as part of the sponsored FlipTheLED project, the solution not only reduces thermal resistance, but also promises substantial savings in the production process.

Another project , “Multi Project Wafer TC3”, presented eight test layouts to show the Institute’s range of capabilities in the field of wafer design.

Conformable electronics was another key theme at the Fraunhofer booth, which included several captivating examples of dynamically flexible, structural 3D electronics and practical use cases for consumer products.
In addition to many other interesting exhibits, the show also introduced the newest developments in panel level packaging to the wider public.

Fraunhofer IZM auf der SMT 2017 - Systemintegration in der Mikroelektronik | Messe Nürnberg
© Fraunhofer IZM

Highlights and more Information


Feature Topic

From Fan-out Wafer to Panel Level Packaging

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. FOWLP has a high potential for significant package miniaturization concerning package volume but also its thickness.


Process and Product Development

Conformable Electronics

Conformable Electronics represents an attractive entry point into the world of dynamically malleable, structural, three-dimensional electronics. All of its processes can use the conventional means of planar production, as the components are only moulded into their final form at the very end of the process.



SMT Hybrid Packaging

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