Fraunhofer Institute for Reliability and Microintegration IZMFraunhofer IZM at SMT 2017
On May 16th, SMT Hybrid Packaging, Europe’s leading exhibition for system integration in electronics, opened its gates to crowds of interested visitors. The Fraunhofer IZM naturally attended in force to show its newest developments in mounting and interconnect technology.
One of the greatest draws at the exhibit was a set of LED modules using innovative flip-chip technology. Designed as part of the sponsored FlipTheLED project, the solution not only reduces thermal resistance, but also promises substantial savings in the production process.
Another project , “Multi Project Wafer TC3”, presented eight test layouts to show the Institute’s range of capabilities in the field of wafer design.
Conformable electronics was another key theme at the Fraunhofer booth, which included several captivating examples of dynamically flexible, structural 3D electronics and practical use cases for consumer products.
In addition to many other interesting exhibits, the show also introduced the newest developments in panel level packaging to the wider public.
