The focus of Fraunhofer IZM’s presentation at this year’s SMT fair in Nürnberg was on system-in-package technologies. Illustrated by SiP demonstrator the technological development from sensor integration via integration power to RF-optimization of highly miniaturized packages was was demonstrated. One highlight was a power system-in-package for maritime applications for use in rough conditions that can withstand salt fog, splash water and high temperatures. Other highlights included:

• Wafer level packaging (wafer level molding, thin chip integration, 300 mm 3D prototyping)
• Substrate integration (embedding, flip chip, COB, encapsulation & molding, flexible systems)
• Reliability (methods, qualification, process- and failure analysis)
• Cost-effective optical interconnection technologies