October 08-10, 2013, Dresden
SEMICON Europa is the largest exhibition in Europe for semiconductor, MEMS and photovoltaic equipment, materials and service suppliers. This year the fair again took place in Dresden.
Together with other Fraunhofer Institutes from the Microelectronics Alliance Fraunhofer IZM presented its latest developments from the realm of wafer level packaging technologies.
The focus was on:
- Silicon interposers
- Through silicon vias
- Fine-pitch redistribution
- Wafer level packaging for optical devices
Fraunhofer IZM’s ASSID group (All Silicon System Integration Dresden) presented its activities in 3D wafer level packaging and wafer stacking.