Dresden, /


SEMICON Europa is the largest exhibition in Europe for semiconductor, MEMS and photovoltaic equipment, materials and service suppliers. This year for the first time the fair took place in Dresden.

Together with other Fraunhofer Institutes from the Microelectronics Alliance Fraunhofer IZM again presented its latest developments from the realm of wafer level packaging technologies. The focus was on:

  • Silicon interposers
  • Through silicon vias
  • Fine-pitch redistribution
  • Wafer level packaging for optical devices
  • Electro chemical plating for device assembly
  • Parametric test systems
  • Chucks for wafer and other substrates

Especially Fraunhofer IZM’s newly established ASSID project group (All Silicon System Integration Dresden) met with lively interest from visitorsASSID introduced its activities in 3D wafer level packaging and wafer stacking.

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