Tech News

To understand the quality of a wire bond with a semiconductor chip, they are subjected to shear tests at the contact point where the wire meets the chip: A chisel shears off these so-called wedges, and the necessary force and resulting damage is analyzed. To learn more about what happens during shearing, researchers from the Technical University of Berlin and Fraunhofer IZM came up with an innovative simulation of the mechanical processes at work. This allows them to understand how newer and more durable wire types affect the behavior of the material and the processes and to produce a more objective and reliable assessment of the bonding quality of such novel materials.

A European research and industry consortium led by Soitec, a world leader in the design and manufacture of innovative semiconductor materials, has begun work to develop a future generation of high-frequency semiconductors based on Indium Phosphide (InP). These technologies are set to address applications ranging from photonics for AI mega data centers to radio frequency filters critical to 6G mobile communications and beyond.

Hand prostheses that restore tactile sensitivity to amputees. Sensors capable of detecting diseases prior to outbreaks. These applications could soon become part of conventional treatment thanks to microchips implanted in the body. At Fraunhofer IZM, the Technologies for Bioelectronics working group is busy developing ultra-thin biocompatible coatings for bioelectronics implants. The core aim is to enable decade-long functionality of miniature implants without the need for surgical interventions.

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX)

WLAN routers made from aluminum, equipped with a versatile multifunctional surface, and made according to the newest EU ecodesign standards: That is the objective of a German-Polish consortium of research and industry partners. With much less plastic used in the design and its circuit boards substantially brought down in size, the proposed routers offer far greater resource efficiency and circularity.

On-board chargers are the great equalizers for electric vehicle charging - and can be a game-changer for the future of e-mobility. Fraunhofer IZM has managed to bring together some of the most innovative ideas in power electronics to pave the way for a new generation of on-board chargers. Twice the performance at half the size, bidirectional capabilities, and efficiently machine-made: The resulting on-board charger is the economical ticket to the fast lane into the future.

The Electronic Components and Technology Conference (ECTC), sponsored by the IEEE Electronics Packaging Society, takes place every year in the USA. For years, Fraunhofer IZM scientists have regularly presented the institute's latest research findings to an international audience of experts. At this year's conference, which took place from May 28 to 31, 2024 in Denver, Colorado, Laura Wenzel, research associate and doctoral candidate at Fraunhofer IZM-ASSID, was honored with the "ECTC Student Travel Award".