Tech News

A new energy label for mobile devices will be mandatory in the EU starting June 20, 2025. This applies to all smartphones and tablets with Android or iPadOS operating systems, ushering in a new era of European product policy. For the first time, an EU-wide standardized label, which Fraunhofer IZM played a key role in developing, evaluates not only the energy efficiency of devices, but also their reliability, durability, and repairability.

Measurable data and narrated stories for sustainable microelectronics - For his pioneering research in sustainable information and communication technologies (ICT) the Fraunhofer Institute for Reliability and Microintegration IZM honors Dr. Lutz Stobbe with the 2025 Research Award. He is being recognized for his work on the life cycle assessment of ICT infrastructures, particularly data centers and network technologies. With his "Sustainable Networks and Computing" working group, Stobbe develops detailed ecological assessment models that precisely record the environmental impact of digital systems throughout their entire life cycle.

A novel way to manage infected wounds and a truly customized treatment without need for antibiotics: That is the idea behind a new medical technology project supported by the Federal Ministry of Education and Research, including the Fraunhofer Institute for Reliability and Microintegration IZM among the research partners.

The Fraunhofer Institute for Reliability and Microintegration IZM proudly marks its 20th anniversary as a member of IVAM – the "International Microtechnology Network". Since joining IVAM in 2005, Fraunhofer IZM has played a pivotal role in advancing micro- and nanotechnology through close collaboration with IVAM’s international ecosystem of innovators, entrepreneurs, and researchers.

The Technologies for Bioelectronics research group at Fraunhofer IZM, led by Prof. Vasiliki (Vasso) Giagka, has made significant progress in collaboration with TU Delft and other partners toward the development of long-term stable neural implants. The joint research focused on improving the durability of silicon-based integrated circuits (ICs) in the corrosive environment of the human body.

Power inverters are the beating heart in the drive train of modern electric cars. They turn the electrical energy from the batteries into something that engines can actually use. Fraunhofer IZM has now redefined what this key component is possible of doing: Using the newest developments in power electronics, the „Dauerpower“ inverter was born that can handle enormous amounts of power with low inductance and in a tiny body - with peak efficiency measured at 98.7%. Let’s roll!

Researchers at Fraunhofer IZM have developed a laser welding process that works without adhesives to connect Photonic Integrated Circuits (PICs) with optical fibers. Uniquely, the technology can be used at cryogenic temperatures down to a mere four Kelvin, -269.15° centigrade below zero. The direct quartz-to-quartz connections created by the technology promise more reliable, faster, and cheaper fiber-PIC- connections that will revolutionize quantum technology applications.

Spring is here and with it, the subtle hum of insect life begins to rise again. Hopefully. Imagine a world where no bees are buzzing around our gardens, no dung beetles or flies recycling the planet’s waste. Sadly, this is not a dystopian science fiction story: research studies conducted in Germany have described more than 75% decline in insect biomass over 27 years. However, insects are one of the most powerful environmental indicators on the planet, providing real-time insights into ecosystem health, climate shifts, and industrial impacts. That´s why Collette Wasielewski (Designer, Marketer and Bug Fanatic) and Tom Cox (Sustainable Technologist and Software Developer) created SPAIA (Society of People Against the Insect Apocalypse). The team is currently working with scientists and advisors from the Start-A-Factory at Fraunhofer IZM, Harper Adams University, and others on an open-source system designed to gather the world’s insect data and make it accessible to everyone who needs it.

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany (Forschungsfabrik Mikroelektronik Deutschland FMD) officially unveiled its new Chiplet Application Hub. Designed to serve as a central platform for the development and application of chiplet technologies, the hub aims to bridge the gap between research and industrial use. By working closely with industry partners, the hub accelerates the development of chiplets made in Germany, elevating industrial research to a new level. At the national level, it complements FMD’s role in the Chips for Europe Initiative, further reinforcing Germany’s technological resilience. The hub's research, development, and prototyping activities build on the infrastructure of the APECS pilot line, ensuring direct pathways to industrial application.

Creating injection-molded electronics in a way that gives developers real freedom in their designs and, even more urgently, is easier on the environment is a major challenge for the industry. The EU Horizon project MULTIMOLD has brought together researchers from Fraunhofer IZM and their international partners in the pursuit of a novel injection molding process that combines advanced electronic functionality with high environmental standards.