For their special webinar on October 28, 2021, Dr. Tanja Braun and Markus Wöhrmann of Fraunhofer IZM gave the participants an insight into multi-project fan-out wafer level packaging with a look at the basics of the technology and more recent trends and  applications. Multi-project wafer processing is common practice for faster and more economical prototyping in the semiconductor industry, and it is now being tried out with fan-out wafer level packaging. The technology is particularly promising for high-frequency applications.