Prof. Ndip also leads the department of RF & Smart Sensor Systems at Fraunhofer IZM Berlin and the IZM Branch Lab for High Frequency Sensors & High Speed Systems in Cottbus. He is an internationally recognized expert in the fields of integrated antennas, high-frequency/high-speed modules, signal/power integrity design and RF/mmWave packaging for a wide range of applications. He is an inventor and holds more than 30 US, European and German patents. Some of his patented Antenna-in-Package (AiP) and RF system integration solutions have been used in many research projects for the development of miniaturized hardware modules for 5G mmWave and 6G THz communication, as well as for proximity sensing and hardware security.

Ivan Ndip has authored and co-authored more than 230 publications in referred journals and conference proceedings. His research has been recognized with numerous Best Paper Awards at leading international conferences as well as with Best Journal Paper Award. His long list of other awards includes the Tiburtius Prize (Preis der Berliner Hochschulen), awarded annually for outstanding Ph.D. dissertations in the state of Berlin, and the Fraunhofer IZM Research Award for his work on the development and successful application of novel methodologies, models and design measures (M3-approach) for optimization of high-frequency and high-speed systems. In 2016, he received the John A. Wagnon Technical Achievement Award from the International Microelectronics Assembly and Packaging Society (IMAPS) for his outstanding technical contributions to the microelectronics industry. Prof. Ndip is an IMAPS Fellow and Senior Member of IEEE, as well as a member of numerous technical program committees of international conferences in his field.

More information on Prof. Ndip’s numerous activities and awards can be found here.