Online event | Expert Session Series / February 09, 2021, 4:00-4:45 p.m.
Thin Film Polymer Materials for Advanced Packages
Challenges and Characterization
Speaker: Markus Wöhrmann
New packaging technologies like Fan-Out Wafer or Panel Level Packaging are based on a broader mixture of different polymeric materails compared to fan-in WLP packages.
In such packages the performance of polymers plays a major role in the built-up structure because it is one of the key layers which act as a buffer between IC and PCB or molding compound.
In addition, the selection of the optimal polymer for a given application depends not only on its physical and chemical properties and processability, but also on its intrinsic interfacial characteristics. Therefore aside of the material properties of the polymer the interaction of the polymer layer with the substrate is important. The material mismatch causes for example warpage and material cracking; the main impact factor being the residual stress in the layers in relation to the fracture toughness of the material and the interface.
These different aspects will be discussed in this webinar together with measuerment techniques for detecting possible weak points.