Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

Trainings and Workshops

Expert Session / May 18, 2021, 4:00-4:45 P.M. (CET)

Advanced Packaging: Simulation, Technology and Reliability

Fraunhofer IZM specializes in applied and industrial contract research. With technology clusters in the field of wafer and substrate process technology as well as a high level of competence in simulation and measurement technology, the entire spectrum required for the implementation of reliable electronics and their integration into the application is covered.

Within the online expert session series "Advanced Packaging: Simulation, Technology, and Reliability" we would like to introduce Fraunhofer IZM and thematize specific technological topics. Especially, we want to show which of our latest research results and approaches you can use for your own applications/developments or as basis for joint projects.

What to expect from our Online-Sessions:
In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.

New topics and dates for this workshop series will be published regularly on this webpage.

Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.

Event details

Location

Online

Date

May 18, 2021, 4:00-4:45 P.M. (CET)

Download this event as iCal

Language

English

Topics and dates

© Fraunhofer IZM

May 18, 2021
Speaker: Nils Nissen

Green Electronics – our required Contribution to Global environmental Goals

There are specific contributions that electronic systems and electronic technologies can and should provide to support combatting climate change. The expert session will, among others, introduce concepts like carbon footprinting and life cycle analysis with relevant examples.

more info

May 4, 2021
Speaker: Daniel Hahn

Reliability Testing of Electronic Systems - Requirements and Challenges

Reliability testing for electronics is in a constant state of change and faces both new and existing challenges. The expert session will give an insight into approaches for reliability testing with a focus on current challenges and new developments.

more info

© Fraunhofer IZM

April 20, 2021
Speaker: Matthias Hutter

Highly reliable Solder and Sintering Technologies

Metal-metal interconnects are important for electronic packaging & assembly. The session will discuss joining/die attach technologies for highest reliability e.g. silver & copper sintering, leading to a higher package lifetime, as well as “transient liquid phase soldering/bonding” (TLPS/TLPB) for different applications.

more info

© Fraunhofer IZM | Volker Mai

April 13, 2021
Speaker: Karl-Friedrich Becker

New Trends in Encapsulation Technologies for SiP and Power Electronics

Encapsulation protects the sensitive wirebonds from environmental influences resulting in molded packages or glob top protected Chip-on-Boards. The session will present encapsulation technologies for advanced SiPs & Power Electronics.

more info

© Fraunhofer IZM

March 23, 2021
Speaker: Lars Böttcher

Panel Level Packaging based on Embedding in PWB Technology

Heterogeneous integration will pass beyond current system in package (SiP) approaches. Embedding is a possible process of integrating components into high-density organic boards (PWBs). The expert session will give an insight into embedding technologies of PWBs.

more info

© Fraunhofer IZM

March 9, 2021
Speaker: Kai Zoschke

2.5D and 3D Wafer Level Packaging

2.5/3D wafer level packaging is one of the important key technologies in advanced microelectronic packaging and system integration worldwide.
The expert session will give an insight into technologies, advantages and applications for 2.5/3D Wafer Level Integration.

more info

© Fraunhofer IZM | Volker Mai

February 23, 2021
Speaker: Oliver Schwanitz

Dielectric characterization of Materials

Dielectric material properties are needed as input for optimized package design of RF systems like 5G.

The expert session will give an insight into different aspects of the dielectric properties, their impacts and how they are extracted.

more info

© Fraunhofer IZM

February 09, 2021
Speaker: Markus Wöhrmann

Thin Film Polymer Materials for Advanced Packages

Polymer materials are essential for the built-up of advanced packages and have an intrinsic influence on the reliability. The expert session will give an insight into the different aspects of polymeric properties, possible failure mechanisms and solutions for high reliability.

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January 19, 2021
Speaker: Olaf Wittler

Controlling Warpage in Electronic System Integration Technologies

Intrinsic stresses and resulting warpage effects can have a major impact on the reliability of electronic packages and assemblies. The expert session will give an introduction to the methodology to characterize, predict and minimize warpage effects.

more info