Online-Session  /  February 27, 2024, 16:00 - 16:45 CET

Highly reliable Interconnect Processes for Power Electronics

3# session of series »Powering the Future - Innovative Technologies for Power Electronics Modules with SiC and GaN Semiconductors«

There are various concepts for assembling power electronics. What all packaging concepts have in common is that high-quality and highly reliable metallic connections are required at many points. These include the die attach, the top-side chip contacts, the joints for load and control and the interconnections to the cooler. Soldering, silver sintering, wire bonding as well as laser and ultrasonic welding are technologies used for these interconnections. The presentation provides an overview of the state of the art as well as the challenges and solutions for these metallic connection technologies.