Key Research Areas

A large number of failures of electronic assemblies can be proven to be due to the influence and effect of humidity. Electronic systems are increasingly exposed to changing climatic environmental influences. At the same time, progressive miniaturization is leading to smaller structural dimensions and consequently smaller packages. Smaller dimensions in the packages also result in smaller diffusion paths for external loads caused by moisture. This can lead to increased electrochemical degradation mechanisms, which received little attention some time ago. In general, the stress of moisture on electronics poses a major challenge for any system. This form of degradation normally leads to failure of the electrical circuit. Therefore, it is important to investigate the materials used for encapsulation in time with regard to their reliability and possible changes in properties. At the same time, the influences and residues to be expected as a result of the manufacturing processes must be taken into account from the very beginning.

The Research Focus deals, i. a., with:

• the investigation of the driving forces and influencing parameters of the failure mechanisms in connection with corrosion and migration phenomena,
• the optimization of the design with regard to operation under harsh conditions,
• the development of evaluation criteria and
• the qualification of possible materials.

For this purpose, different methods are used as well as combined in this research focus.Particularly noteworthy are:

• Electrochemical measurement methods
  • Cyclic voltammetry (CV)
  • Current density potential measurement (LP)
  • Open-circuit potential measurement (OCP)
• High Humidity High Temperature Reverse Bias Test (H3TRB)
• Surface Insulation Resistance Test (SIR)
• Analytical methods o Focused Ion Beam (FIB)
  • Scanning Electron Microscopy (SEM)
  • Energy Dispersive X-ray Spectroscopy (EDX)
  • ….
• Simulation approaches