Testing, Qualification, Reliability

Mechanical and thermal characterisation of materials

Mechanical Bending Test of a PCB Assembly
© Fraunhofer IZM
Test Set-up for determination of coefficient of thermal expansion

Precise materials data form the basis for reliable products. Understanding the properties of materials and knowledge of the relationship between production processes, stresses and failure mechanisms enables the improvement of processes and products.

Materials can be characterised individually or in their application.

The measurements can also be carried out at various levels of environmental conditions (e.g. humidity and temperature), in order to determine the material behaviour for the process or application conditions.

For reliability assessments with FEM simulations, the parameters can be used to calibrate material models.

Key material characteristics, which can be analysed in our Lab are:

  • Mechanical parameters (e.g.Young’s-modulus, Yield stress, strain of break etc.) in wide range of sample geometries (macroscopic and microscopic) under static and dynamic loading
  • Determination of Poisson’s ratio for material samples with optical deformation analysis
  • Elastic, plastic, viscoelastic, hyperelastic properties
  • Determining temperature- and time-dependent behaviour  of adhesives, polymers, moulding compounds (Relaxation/Retardation)
  • Investigation of fatigue behaviour (LCF/HCF)
  • Analysis of creep properties of metals and metal alloys (e.g. solder) under stress for the description of damage accumulation
  • Influence of harsh environmental conditions (e.g.moisture) on materials properties
  • Determination of thermally induced deformation behaviour (e.g. CTE,Tg)  over the range -100°C to 450°C of different materials and components
  • Determination of fracture-mechanical properties: Assessment of toughness for the micro/nano range and experimental fracture mechanics at the interface
  • Warpage characterization of components and substrates
  • Material characterization by in-situ testing methods

If you do not find your need in our list, please contact us. We are happy to develop and validate new techniques for your specific application requirement.



Thermal management

Careful thermal management is important to ensure reliable operations even with high power losses, and high heat fluxes and ambient temperatures.



Corrosion, electrochemical migration and humidity diffusion

Modern electronic systems are increasingly exposed to constantly changing environments in terms of humidity and variations of temperature cycling and thermal shocks.



Vibration measurements and tests



Reliability evaluation with FEM

To identify weak points in the early stages of development, or to obtain the optimum geometry under consideration of external loads, finite element simulation (FE) are applied.  


Download - Flyer

Robustness and Life Cycle Assessment