It is important to know about the behaviour of electronic components in real-life conditions, when reliability is to be assured. One aspect is a possible deformation of the whole component or even parts of a system like single materials or substrates. The in-plane und out-of-plane deformation of materials or composites due to external loads or internal stresses can be investigated. Moreover the results can be used to validate FE-simulation results or to use a combination of FE-Simulation and measurement in order to control and reduce the observed warpage effect.
Different optical measurement methods are available to address different test conditions, resolution and specimen sizes. They can be selected depending on the components to be investigated and the field of application. For example the following tasks can be solved:
- Measurement of topography, roughness and waviness of modified surfaces
- Determination of warpage with or without thermal load
- In-Plane Measurements of deformation and geometry with and without thermal load
- Multiscale analysis of longitudinal and transversal strain of mechanically loaded components