Process and Product Development

Thermal Management

Minimising the thermal resistance of packages by the design and optimisation of cooling concepts, taking into account high power losses, heat flux,and ambient temperatures.

Design Assessment and Optimization for Reliability

Using FEM analysis, alternative designs can be assessed and optimised in terms of reliability and durability.


Environmentally compatible product design requires an interdisciplinary approachcovering the entire lifecycle of the product. We offer support with strategic decision-making in the development of electronicproducts.