Search
Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
Publications
Contact / Locations
Deutsch
The Institute
[X]
The Institute
About Fraunhofer IZM
Collaborating with Fraunhofer IZM
Networking with Science and Industry
Infrastructure and Equipment
Awards
Education
From Wafer to Product
Feature Topics
Departments
[X]
Departments
Wafer Level System Integration
Key Research Areas
Process Technologies
Services
Equipment
System Integration & Interconnection Technologies
Key Research Areas
Services
Equipment
Working Groups
Environmental & Reliability Engineering
Key Research Areas
Services
Equipment
Working Groups
RF & Smart Sensor Systems
Key Research Areas
Services
Equipment
Working Groups
Business Units
[X]
Business Units
Energy
Photonics
Semiconductors & Sensors
Automotive
Medical Engineering
Industrial Electronics
Services
[X]
Services
Innovation Workshops / Feasibility Studies
Product Development Consultation
Process and Product Development
Testing, Qualification, Reliability
Manufacturing & Prototyping
Training
News & Events
[X]
News & Events
Tech News
Events
Event Review
Newsletter
More
Wafer Level System Integration
Equipment
Where am I?
Homepage
Departments
Wafer Level System Integration
Equipment
Equipment
Integration at Wafer Level
ASSID (Dresden): Complete Cu-TSV Process Line
more info
Berlin: Wafer Level Packaging Line
more info
Related Links:
Key Research Areas
Process Technologies
Services
Fraunhofer Institute for Reliability and Microintegration IZM