Working Groups

High-Frequency Interconnects & Components

In our High-Frequency Interconnects & Components Group, we apply our holistic design method, the M3-appraoch (methodologies, models, measures), to systematically design, test, characterize and optimize electronic packaging interconnects, integrated antenna arrays and RF frontend components such as filters, inductors and power dividers, specifically for the following:

  • Wireless communication infrastructure (e.g. base stations) for 4G, 5G and future 6G mobile networks (radio access network, backhaul, core…)
  • Satellite communication systems for LEO, MEO and GEO (ground and space segments)
  • Radar sensors for automotive/autonomous driving, transportation systems (e.g. trains and logistic processes) and home automation

We provide the following R&D services:

Hochfrequenz- Charakterisierung, Design & Optimierung von Packaging-Technologien und Interconnects
© Fraunhofer IZM | Volker Mai
  • High-frequency design, measurement and optimization of packaging interconnects from 100 MHz to 500 GHz
    • Chip interconnections, e.g., bond wires, ribbon bonds and flip-chip interconnects
    • Planar and vertical interconnects (e.g. transmission lines and vias) in redistribution layers, interposers/chip carriers (e.g., organic, mold, ceramic, glass and silicon), advanced packages (e.g., PCB embedding, fan out wafer level packaging) and in system-boards
    • Package-to-board and board-to-board interconnects (e.g., BGA balls, sinter interconnects)
    • RF connectors
  • Design, test and optimization of integrated antenna arrays and RF frontend components such as filters, power dividers and inductors for the following:
    • Wireless communication infrastructure (e.g., base stations) for 4G, 5G and future 6G mobile networks (radio access network, backhaul, core…)
    • Satellite communication systems for LEO, GEO and MEO (ground and space segments)
    • Radar sensors for automotive/autonomous driving, transportation systems (e.g., trains) and home automation
  • Measurement of radiation pattern and gain of antennas up to 325 GHz
  • Measurement of S-parameters of packaging interconnects, antennas and RF frontend components in dependency of frequency (up to 500 GHz) and temperature (-30°C to 150°C)
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