High-Frequency Interconnects & Components
In our High-Frequency Interconnects & Components Group, we apply our holistic design method, the M3-approach (methodologies, models, measures), to systematically design, test, characterize and optimize electronic packaging interconnects, integrated antenna arrays and RF frontend components such as filters, inductors and power dividers, specifically for the following:
- Wireless communication infrastructure (e.g. base stations) for 4G, 5G and future 6G mobile networks (radio access network, backhaul, core…)
- Satellite communication systems for LEO, MEO and GEO (ground and space segments)
- Radar sensors for automotive/autonomous driving, transportation systems (e.g. trains and logistic processes) and home automation