RF Materials & Interconnects
The RF Materials and Interconnects working group applies holistic methods for the characterization and design of packaging interconnects and the dielectric characterization of materials in high-frequency technology. It possesses particular expertise in the accurate determination of permittivity and dielectric loss tangent of materials for frequencies reaching the THz range.
- Metrological dielectric material characterization in relation to frequencies and temperatures
- Support for the selection of dielectric materials suitable for the target application
- HF characterization and design of package interconnects to match the chosen technology and the unique requirements of the specific application
- Calibrated HF (up to 500 GHz) measurement of packaging structures