Working Group - Wireless Communication Modules

In the Wireless Communication Modules Group, we apply our holistic design method, the M3-approach (methodologies, models, measures), to systematically design, test, characterize and optimize energy efficient wireless communication modules at microwave, millimeter-wave (mmWave) and terahertz (THz) frequencies, specifically for the following applications:

• Wireless communication infrastructure (e.g. base stations) for 4G, 5G and future 6G mobile networks (radio access network, backhaul, core network)
• Satellite communication systems for low earth, medium earth and geostationary orbits (LEO, MEO and GEO) both ground and satellite terminals

We provide the following R&D services

• Development of hardware architectures for wireless communication frontend modules, e.g. active antenna systems (AAS), multiple-input multiple-output (MIMO) antenna arrays-based modules, Antenna-in-Package (AiP) and Antenna-on-Package (AoP) solutions, Package-on-Package (PoP) configurations
• Development of system integration platforms tailored to given application using a wide range of packaging technologies and considering RF, fabrication, thermal and thermo-mechanical reliability requirements
• 3D electromagnetic field simulation of integration platforms and their packaging building blocks
• RF, signal and power integrity compliant design and layout of frontend modules, also with regard to miniaturization and high density integration (HDI)
• Measurement-based characterization of frontend modules and their building blocks