Integration of Electronics into New Materials
With the trend to customize electronic modules for specific applications, there is a need for integration technologies in new materials which are new in microsystem technologies. Materials like paper or lignin can be required due to ecological reasons or for applications in wood and paper industry. Thermoplastic materials are applied for instance where subsequent lamination processes are performed. Other applications may require the integration in textiles.
For each of these areas a specific integration technology hast o be developed as the requirements regarding materials and process parameters vary. The available equipment together with the competence in chip preparation, integration and analytics allows the development of new qualified integration processes.