Core of the overall concept is the realization of three-dimensional optical routing on board level using electrical-optical circuit boards (EOCB) in combination with electro-optical transceivers. Optical signal transmission allows high-performance products with significantly improved performance, reliability, lower costs and higher energy efficiency.
The goal of the ongoing development is the integration of optical transmission paths into the printed circuit board (PCB), creating a hybrid electrical-optical PCB. Future bandwidth needs forces the development of optical integrated waveguides on board level. Our development is focused on industrial manufacturing technologies for micro-optic integration, patterning and lamination of glass. Already established methods in micro system technology are combined with new approaches. For thin glass embedding into the printed circuit board relies on proven industrial processes of PCB industry, which can be performed with existing equipment. The manufacturing process for optical waveguide integration into the thin glass is performed by ion exchange technology. Our work also involves the development of optical coupling interfaces between EOCB, electro-optical transceivers and fiber cables.