Electro-optical Circuit Board (EOCB)

eocb Fraunhofer IZM
© eocb Fraunhofer IZM

Cross section of electro-optical circuit board with 12 waveguides integrated into an embedded glass core.

eocb Fraunhofer IZM
© Fraunhofer IZM

Electro-optical circuit board with embedded glass core.

Thin glass sheet with integrated single-mode glass waveguides and electrical redistribution layer for interposers of Silicon Photonics.
© Fraunhofer IZM

Thin glass sheet with integrated single-mode glass waveguides and electrical redistribution layer for interposers of Silicon Photonics.

Core of the overall concept is the realization of three-dimensional optical routing on board level using electrical-optical circuit boards (EOCB) in combination with electro-optical transceivers. Optical signal transmission allows high-performance products with significantly improved performance, reliability, lower costs and higher energy efficiency.

The goal of the ongoing development is the integration of optical transmission paths into the printed circuit board (PCB), creating a hybrid electrical-optical PCB. Future bandwidth needs forces the development of optical integrated waveguides on board level. Our development is focused on industrial manufacturing technologies for micro-optic integration, patterning and lamination of glass. Already established methods in micro system technology are combined with new approaches. For thin glass embedding into the printed circuit board relies on proven industrial processes of PCB industry, which can be performed with existing equipment. The manufacturing process for optical waveguide integration into the thin glass is performed by ion exchange technology. Our work also involves the development of optical coupling interfaces between EOCB, electro-optical transceivers and fiber cables.

Laminated EOCB with open cavities for optical coupling participating in HDP User Group, International | Fraunhofer IZM | Volker Mai
© Fraunhofer IZM | Volker Mai

Laminated EOCB with open cavities for optical coupling participating in HDP User Group, International

Projects related to EOCB

SEPIANet

The project aim was to develop technology solutions for embedded optical architectures in access network head-end systems to allow significant reduction in power consumption, increased energy efficiency, system density and bandwidth scalability, which is currently unfeasible in today's copper driven access network systems.

PhoxTroT

High Performance computing and data centers need to become both more energy efficient and powerful. This ambitious goal is part of the „PhoxTroT“ project of 17 partners and Fraunhofer-institutes.

HighConnect

Validation of a technology manufacturing-ready integration of nano-dimensional of Silicon Photonics in hybrid electrical-optical Circuit Boards

HyPOT

Goal of the project was to enable a glass interposer for 25Gb/s/ch including through glass vias and high frequency signal optimization. A very high performance is achieved by a new approach for an optical active interposer system.

 

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Electro-optical Circuit Board