Photonics Packaging, Integration and Services for Optical Systems

Fraunhofer IZM develops photonic packages, modules and system solutions for communications, quantum technologies, nuclear fusion, materials processing and sensing. We combine microelectronics packaging, optoelectronics, integrated optics, micro-optics and panel-level integration into robust, production-oriented solutions – from feasibility to industrialization.

For service partners, technology providers and industrial companies, we provide hands-on support in Design for Manufacturing, Design for Reliability, optical coupling, photonic design, thermal management, testing, failure analysis and qualification. This reduces development risks and prepares scalable solutions for series applications.

Core competencies:

• Photonic packaging for PICs, sensors, light sources and optoelectronic modules
• Hybrid integration of optical, electronic, RF and thermal functions
• Fiber-array, lens and micro-optics integration with precise alignment
• Wafer-level, interposer and board-level integration for compact, scalable architectures
• Testing, failure analysis and reliability assessment for production-oriented qualification

For research partners, we turn scientific concepts into industrial applications, including Co-Packaged Optics, chiplet and interposer approaches, fiber-optic sensing, process monitoring, medical technology, industrial automation and energy. You will find an overview of Fraunhofer IZM services relating to optical technologies here.

As a development, service or consortium partner, Fraunhofer IZM brings photonic innovations reliably from the lab into robust applications.