Key Research Areas

System-in-Package by Substrate Integration


Substrate Finish and Reliability

Surface finish reliability is increasingly important for packaging and system reliability. Key aspects of our activities are failure analysis and documentation at boards/ devices/ components, finish characterization, finish development and optimization, system dependent root cause analysis.


Micro Galvanics

Metallic surfaces are of interest as contact areas in electronic applications, micro galvanics surfaces have a high potential for micro electrode applications and sensorics because of its special 3d surface profile with sharp erected edges in nanometer range and an surface enlargement up to factor 10.