Working Group Metallic Interconnection Technologies

We develop and quality interconnection technologies (soldering, sintering, transient liquid phase bonding) on first (flip chip, die attach) and second level.  Applications fields are micro-, power and optoelectronics as well as RF. Besides that we are focused on interconnection technologies for high operating temperatures. The qualification and test center is part of the group and is focused on the qualification of printed wiring assemblies, reliability testing and failure analysis.