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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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Wafer Level System Integration
Technology and Project Information
Technology and Project Information
Data & Technology Sheets
Data sheet Chip to Wafer Assembly (2025) [ PDF 1.17 MB ]
Data sheet TSV into CMOS integration (2025) [ PDF 0.84 MB ]
Data sheet Wafer-Level Device Capping (2025) [ PDF 0.94 MB ]
Data sheet 3D Integration for High Performance Packaging (2025) [ PDF 1.01 MB ]
Data sheet 3D X-Ray Detector Modules based on TSV Technology (2025) [ PDF 0.34 MB ]
Data sheet WL-MEMS Packging (2025) [ PDF 1.06 MB ]
Data sheet flex or rigid-flex Circuits (2024) [ PDF 0.46 MB ]
Data sheet Flexible Multi-layer Substrate (2024) [ PDF 0.5 MB ]
Data sheet Through Glass Vias (2023) [ PDF 0.37 MB ]
Data sheet Copper Polymer Kit (2023) [ PDF 0.52 MB ]
Data sheet Detector Packaging for X-Ray (2023) [ PDF 0.57 MB ]
Data/project sheet MEMS-based IR imaging sensor chips_APPLAUSE (2023) [ PDF 1.14 MB ]
Data sheet LIDAR Sensors 3D SiP (2019) [ PDF 0.14 MB ]
Data sheet CarrICool (2019) [ PDF 0.23 MB ]
Data sheet Testchip Design-ASSID (2018) [ PDF 0.29 MB ]
Data sheet Wafer Level Packaging of Power Devices (2018) [ PDF 0.17 MB ]
Data sheet TMR Position Sensor Module (2018) [ PDF 0.19 MB ]
Data sheet Hermetic Wafer Level Packaging of LED Modules (2018) [ PDF 0.15 MB ]
Info brochure Silicon Microsensors (2016) [ PDF 1.06 MB ]
Data sheet Thin Wafer Handling (2015) [ PDF 0.18 MB ]
Project Information
Project Information T4T (2024) [ PDF 0.4 MB ]
Project Information SiEvEI 4.0 (2024) [ PDF 1.38 MB ]
Project sheet USeP (2023) [ PDF 0.42 MB ]
Project Information Rewal (2023) [ PDF 1.46 MB ]
Project Information SILHOUETTE (2023) [ PDF 0.79 MB ]
Fraunhofer Institute for Reliability and Microintegration IZM