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Fraunhofer Institute for Reliability and Microintegration IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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General Information Department WLSI
WLSI brochure - with focus on activities at ASSID/Moritzburg [ PDF 1.02 MB ]
WLSI brochure - with focus on activities in Berlin [ PDF 1.13 MB ]
Overview ASSID - japanese [ PDF 0.36 MB ]
Customer Service Imformation
Service-Overview IZM-ASSID [ PDF 1.67 MB ]
Datasheet_WaferLevelMEMSPackaging-ENG-web.pdf [ PDF 0.43 MB ]
Datasheet_CopperPolymerKit-ENG-web.pdf [ PDF 0.52 MB ]
Datasheet_X-Ray-ENG.pdf [ PDF 0.57 MB ]
Datasheet_MEMS-based IR imaging Sensor chips_FV-web.pdf [ PDF 1.14 MB ]
Datasheet_USeP-ENG.pdf [ PDF 0.42 MB ]
LIDAR Sensors 3D SiP [ PDF 0.14 MB ]
Wafer Level Packaging of Power Devices [ PDF 0.17 MB ]
TMR Position Sensor Module [ PDF 0.19 MB ]
Flexible Multi-layer Substrate [ PDF 0.15 MB ]
Hermetic Wafer Level Packaging of LED Modules [ PDF 0.15 MB ]
3D Hybrid Pixel Detector Module [ PDF 0.16 MB ]
Wafer-Level Device Capping [ PDF 0.21 MB ]
Wafer-Level MEMS Packaging [ PDF 0.12 MB ]
Thin Wafer Handling [ PDF 0.16 MB ]
Flyer "Silicon Microsensors" [ PDF 1.06 MB ]
Project info NaLaSysPro [ PDF 0.18 MB ]
Infosheet CarrICool [ PDF 0.22 MB ]
Infosheet Testchip Design-ASSID [ PDF 0.26 MB ]
TSV into CMOS integration [ PDF 0.14 MB ]
Fraunhofer Institute for Reliability and Microintegration IZM