Feature Topics


The research area “reliability” is particularly significant at Fraunhofer IZM, as different materials with diverse thermal, mechanical and thermomechanical properties are used in the packaging process. Ensuring that the resulting systems function reliably in increasingly harsh environmental conditions (high temperatures, vibration, high current densities and voltages) for a predetermined operating time is always at the forefront of research and development, regardless of the application area the system is intended for. The development process is approached systematically. From the very beginning, physics-of-failure models are used as a tool for selecting materials with suitable properties in terms of thermomechanical tension and thermal performance. We have comprehensively equipped mechanical and thermal laboratories available for identifying the necessary material properties. A thorough understanding of the joining and encapsulation technologies and processes is also required to ensure highest reliability. In other words, the system must be grasped from all angles.

Fraunhofer IZM also lends a hand if your product experiences early failure. Using modern damage analysis techniques in combination with the staff’s technological know-how, the faults are identified and solutions suggested. A new research area focuses on “Condition Monitoring”, in which the condition of a system is monitored during operation based on selected condition indicators. The aim is identifying the failure before it takes place. For example, in a car, a component that is about fail can be replaced before the vehicle breaks down.

Reliability: simulation, test and optimization

Reliability: simulation, test and optimization cover the development and application of experiments and simulations which make it possible to "Design for Reliability".


Materials Characterization and Modeling

Electronic systems are subjected to numerous environmental influences throughout their working life. Factors such as mechanical forces, temperature fluctuations and exposure to moisture can significantly impair the reliability. 

Qualification and Test Center (QPZ)

Forces and factors affecting a product’s reliability need to and can be identified and optimized with due consideration for the definded use cases.

Condition monitoring of electronics

The highest levels of availability and lowest failure rates are key requirements for durable and high quality products and main criteria for increasing sustainability. Concepts for condition monitoring are based on the identification and intelligent and efficient recording of relevant system parameters and simultaneous evaluation and calculation of reliability purposes.

Reliability management along the product life cycle

Our primary task is to control the management activities for achieving reliable products and processes throughout the entire product lifecycle.

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Robustness and Life Cycle Assessment