Events

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  • Mercure Hotel MOA Berlin / July 02, 2025 - July 03, 2025

    Component-to-System Level Packaging Workshop

    Component-to-System Level Packaging Workshop

    The road to autonomous driving and the need for more electrified mobility have resulted in sizable changes for electronics such as semiconductors and batteries used in automotive applications. Smart homes and infrastructure, factory automation and preventive maintenance have driven significant advancements in industrial electronics too.

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  • Change Hub Berlin / October 15, 2025 - October 16, 2025

    Green ICT Connect 2025

    Green ICT Connect 2025 - key visual
    © loewn

    To promote an exchange between science, industry and politics on the topic of resource conservation in ICT, high-ranking representatives will meet for the third time at the conference for resource-conscious information and communication technologies »Green ICT Connect 2025«.

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  • Fraunhofer Institute for Reliability and Microintegration IZM / November 06, 2025 - November 07, 2025

    Electronic Packaging Days 2025

    On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners.

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