electronica – inside tomorrow / 11/13/2018 - 11/16/2018
IZM-focus on manufacturing technologies at electronica 2018
At electronica 2018, the world’s leading trade fair for electronics components, systems and applications. Fraunhofer IZM together with eleven other Fraunhofer institutes will be presenting a broad spectrum of research projects and findings from November 13-16 in Munich.
The IZM-colleagues will be showcasing recent research results from the realms of manufacturing Technologies
- Packaging, interconnection and bonding technology
- Wafer Level Packaging
- Electro-optical Circuit Board (EOCB)
- Application-specific hybrid circuits
- RF assemblies and material characterization
- Systems integration
We look forward to seeing you at the joint Fraunhofer booth in Hall C5, Booth 426 and at the Fraunhofer IZM/ASSID booth in Hall A4, Booth 421.