New Processes for Embedding Electronic Components in Large-Area Organic Substrates


© Fraunhofer IZM

The project is dedicated to the development of new processes and machines for a novel form of packaging in microelectronics: panel-level packaging. Combined circuit board and thin-film technologies are used to embed microchips and other electronic components into thin organic substrates, paving the way for the cost-efficient, large-scale production of complex modules with unprecedented levels of miniaturization possible.

Logo - Federal Ministry of Education and Research (BMBF)

Project Partners

  • Schmoll Maschinen GmbH
  • CreaVac GmbH
  • Dr.-Ing. Max Schlötter GmbH & co. Kg

Worldwide Network

Panel Level Consortium 2.0

Actual exploitation remains one of the top-line concerns and limits of FOPLP technology. The project intends to expand the current cost model with a granular routing model, also covering  other packaging architectures and opportunities for introducing the required software adjustments with an eye on ease of use.

IEEE Xplore

Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology

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