Conference / 10/22/2019 - 10/24/2019
International Wafer Level Packaging Conference
At IWLPC 2019, IZM researcher Dr. Tanja Braun and E. Jan Vardaman of TechSearch International will chair a panel discussing the challenges of developing new large-format substrates.
The International Wafer Level Packaging Conference will take place from October 22 to 24 in San Jose, California. The latest developments in the areas of wafer level packaging, 3D, through-silicon vias (TSV), and micro-electromechanical systems (MEMS) will be presented in lectures, discussions, and courses.
Fraunhofer IZM will be represented at IWLCP by figures including Dr. Tanja Braun, who, together with E. Jan Vardaman of TechSearch International, will present a panel on October 22 on the topic “Large Organic Panels: How Can We Achieve 2µm L/S?”
At the accompanying trade fair, Fraunhofer IZM will showcase the latest developments from the field of wafer level packaging. Our colleagues are looking forward to meeting you at booth 41.