Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Nürnberg Messe / June 09, 2026 - June 11, 2026

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Hall 1, Booth 1-317

Discover the newest tech from Fraunhofer IZM at SENSOR+TEST 2026: Energy-efficient solutions for highly miniaturized sensor systems (green ICT), innovative hardware concepts, and radar sensors. The show will include recent research and innovations in advanced packaging, smart system integration, and panel to wafer-level thin glass photonics.

Meet our experts from the RF & Smart Sensor Systems, Wafer Level System Integration, and Optical Interconnect Technology departments and exchange experiences.

Fraunhofer IZM is bringing news and insights in several areas to SENSOR+TEST 2026:

High-End Performance Packaging

Hybrides Pixeldetektormodul für Röntgenuntersuchungen mit Siliziumsensor — © Fraunhofer IZM | Volker Mai
Hybrid pixel detector module with silicon sensor for use in X-ray exams

Fraunhofer IZM is a global leader in wafer-level system integration, with groundbreaking technologies like vertical vias for silicon and glass wafers, high-density multi-layer wiring systems using thin film technology, wafer-level housing and encapsulation concepts, and novel ways to connect ICs and substrates with the thinnest of metallic contacts.
Hybrid pixel detector modules are the state of the art for synchrotron and X-ray imaging experiments. With its compact X-ray detector in a USB stick form factor, the »Wafer Level System Integration« department is showcasing its expertise in packaging and interconnection technologies for highly integrated pixel detector systems.

On show:

Wafer-level 3D integration
Compact and powerful microsystems with wafers equipped with TSV & TGV structures | Read more
Wafer-level chip integration
Chip-to-wafer assembly for highly scalable system integration | Read more
Reliable encapsulation for IR sensors
Hermetically sealed microbolometer modules for infrared imaging and wafers | Download Datasheet (.pdf)
High-resolution X-ray detection | Download Datasheet (.pdf)
CdTe sensor module for research, medicine, and industry
Flexible electronics with integrated functions
Flex modules and wafers with embedded ICs and sensors | Read more | Download Datasheet (.pdf)
Compact system-in-package solutions | Read more | Download Datasheet (.pdf)
FOWLP demonstrator (USeP module)

Optical Interconnection Solutions for Photonics and Electronics Integration

Mit Prozessen auf Waferebene erstellter strukturiert-metallisierter Dünnglas-Interposer – vor der Bestückung mit photonischen Komponenten (und Package-Verschluss) für biomedizinische und Telekommunikationsanwendungen — © Fraunhofer IZM | Volker Mai
Thin glass interposer with structured metallization created using wafer-level processes – before assembly with photonic components (and package closure) for biomedical and telecom applications (unpopulated).

The IZM specialists for »Optical Interconnection Technology« are working on solutions for integrating photonics and electronics, with 2D connectivity for electro-optical printed circuit boards and 3D connectivity by photonic system assembly.

Thin glass technologies make it possible to create laser-structured, hermetically sealed optical interfaces in stacked packages - scalable in panel and wafer processes.

At Sensor+Test 2026, the group will showcase photonic wire bonding, micro-optical printing, among other things.

PhotonicLEAP: Glass interposer for photonic ICs
Hermetically sealed interposer platform based on glass: TGVs for electrical and optical integration of PICs

Download PDF

Energy-efficient Sensors for Industry, Logistics, and Maintenance

Energieeffiziente modulare Multi-Sensor-Plattform SWARMY — © Fraunhofer IZM | Volker Mai
Energy-efficient modular multi-sensor platform SWARMY

On show:

Embedded RTOS for underwater applications
LoLiPoP IoT: Long-lasting energy platforms for the Internet of Things
Autonomous sensor nodes for monitoring bulk goods in large silos | Read more
Fortune 2.0: Sensor gateway for edge-AI applications
Autonomous and adaptive solution for AI-driven condition monitoring (Industry 4.0) | Read more | Download Datasheet (.pdf)
SWARMY 2.0: Sensor solutions for retrofitting industrial systems
Energy-efficient modular multi-sensor platform with local data processing and wireless communication for state monitoring in industrial systems and processes | Read more | Download Datasheet (.pdf)
Hybrid AI processor architecture

MIMO Radar Modules for 24, 60, and 79 GHz

Kompaktes 79-GHz-MIMO-Radar mit integrierten 3D-Antennen, 180°-Sichtfeld und 4°-Winkelauflösung — © Fraunhofer IZM | Volker Mai
79 GHz compact MIMO radar with integrated 3D antennas, 180° field of view, and 4° angular resolution

Exhibits on show:

AKiRA 3D: 3D MIMO radar modules
Compact 79 GHz MIMO radar with integrated 3D antennas, 180° field of view, and 4° angular resolution | Read more (german) | Download Datasheet (german/ .pdf)
PLAKIRA: Multiple cascaded radar chips for high-resolution MIMO radar systems
Hybrid radar hardware for quick ranging in all directions for safety-related applications, including interactions with autonomous vehicles or robots. | Read more
KameRad: Sensor-fusion 79 GHz radar & camera
360° radar sensors to help autonomous vehicles navigate their surroundings
Radar platform: MIMO radar kit for fast prototyping
Development platform for trialing 24, 60, and 79 GHz radar applications before the availability of the final product hardware | Download Datasheet (.pdf)

Learn more about our research focus areas

Energy-autonomous sensor nodes

The »Sensor Nodes & Embedded Microsystems« group specializes in the design and creation of networked and energy-efficient self-sufficient wireless sensor nodes. Components and complete systems are modeled and simulated to determine key system and performance parameters like their functionality, energy needs, and operational reliability. The results can be taken into account at an early stage in the design and implementation process.

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Development of embedded hardware systems with edge AI

Fraunhofer IZM develops embedded hardware systems tailored specifically for the use of artificial intelligence that optimize the efficiency and performance of data processing at the source.

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Radar Frontends & Modules

We focus on the optimized design and characterization of RF/millimeter-wave radar modules using the M3 approach (methods, models, measures). Based on the application requirements, the implementation concept is developed in conjunction with the M3 approach.

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Photonic Packaging & Interconnection Technologies

Our core competence is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Prototyping and hardware demonstrators are realized on the basis of systematic simulation, customer-specific design, and reliability and failure mechanisms investigations. This wide base serves the development of customer-specific solutions and cutting-edge scientific development in photonic packaging and interconnection technologies leading to excellence in service provision.

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Hermetic MEMS & Sensor Packaging

The combination of active or passive TSV silicon interposer wafers with cap wafers by wafer to wafer bonding technologies offers new possibilities for hermetic wafer level packaging of MEMS components. Based on its 200 mm / 300 mm compatible advanced wafer level packaging process lines, Fraunhofer IZM can support such new hermetic wafer level MEMS packaging concepts.

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Tech News

Current technology developments, awards, events and more ...

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Events

Fairs, conferences, events

Here you find current events organized by or with the participation of Fraunhofer IZM

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Trainings &
Workshops

Training courses offered by Fraunhofer IZM in the areas of system design, integration technologies and materials & reliability

Events

Nürnberg Messe / June 09, 2026 - June 11, 2026