Fraunhofer Institute for Reliability and Microintegration IZM

Events

Nürnberg Messe / May 11, 2027 - May 13, 2027

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Hall, Booth t. b. a.

Discover the newest tech from Fraunhofer IZM at SENSOR+TEST 2026: Energy-efficient solutions for highly miniaturized sensor systems (green ICT), innovative hardware concepts, and radar sensors. The show will include recent research and innovations in advanced packaging, smart system integration, and panel to wafer-level thin glass photonics.

Meet our experts from the RF & Smart Sensor Systems, Wafer Level System Integration, and Optical Interconnect Technology departments and exchange experiences.

Fraunhofer IZM is bringing news and insights in several areas to SENSOR+TEST 2027.

Learn more about our research focus areas

Energy-autonomous sensor nodes

The »Sensor Nodes & Embedded Microsystems« group specializes in the design and creation of networked and energy-efficient self-sufficient wireless sensor nodes. Components and complete systems are modeled and simulated to determine key system and performance parameters like their functionality, energy needs, and operational reliability. The results can be taken into account at an early stage in the design and implementation process.

more info

Development of embedded hardware systems with edge AI

Fraunhofer IZM develops embedded hardware systems tailored specifically for the use of artificial intelligence that optimize the efficiency and performance of data processing at the source.

more info

Radar Frontends & Modules

We focus on the optimized design and characterization of RF/millimeter-wave radar modules using the M3 approach (methods, models, measures). Based on the application requirements, the implementation concept is developed in conjunction with the M3 approach.

more info

Photonic Packaging & Interconnection Technologies

Our core competence is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Prototyping and hardware demonstrators are realized on the basis of systematic simulation, customer-specific design, and reliability and failure mechanisms investigations. This wide base serves the development of customer-specific solutions and cutting-edge scientific development in photonic packaging and interconnection technologies leading to excellence in service provision.

more info

Hermetic MEMS & Sensor Packaging

The combination of active or passive TSV silicon interposer wafers with cap wafers by wafer to wafer bonding technologies offers new possibilities for hermetic wafer level packaging of MEMS components. Based on its 200 mm / 300 mm compatible advanced wafer level packaging process lines, Fraunhofer IZM can support such new hermetic wafer level MEMS packaging concepts.

more info

Tech News

Current technology developments, awards, events and more ...

more info

Events

Fairs, conferences, events

Here you find current events organized by or with the participation of Fraunhofer IZM

more info

Trainings &
Workshops

Training courses offered by Fraunhofer IZM in the areas of system design, integration technologies and materials & reliability

Events

Nürnberg Messe / May 11, 2027 - May 13, 2027

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Meet our experts on site!

Location:

Date:

Learn more about our research focus areas

Energy-autonomous sensor nodes

Development of embedded hardware systems with edge AI

Radar Frontends & Modules

Photonic Packaging & Interconnection Technologies

Hermetic MEMS & Sensor Packaging

Follow us

Tech News

Events

Trainings &
Workshops

Stay in contact!

Event Review

Contact Press / Media

Katja Arnhold

Nürnberg Messe / May 11, 2027 - May 13, 2027

Fraunhofer IZM at the Measurement Fair SENSOR+TEST

Learn more about our research focus areas

Energy-autonomous sensor nodes

Development of embedded hardware systems with edge AI

Radar Frontends & Modules

Photonic Packaging & Interconnection Technologies

Hermetic MEMS & Sensor Packaging

Follow us

Tech News

Events

Trainings &Workshops

Stay in contact!

Event Review

Trainings &
Workshops