Metallic connection to the cooling system for power electronic modules

Großflaechige Loetung
© Fraunhofer IZM
Power module from the SiC module project (design IZM, PCB production Schweizer Electronic AG*) including X-ray image. It can be seen that, particularly in the plane between the assembled substrate and the cooler, there is a very good large-area soldering (very good wetting and only very few small pores present) with a Sn-based solder.

Optimized thermal management is particularly important in power electronics. Improving the thermal connection between the package/module and the cooling structure can increase the service life of the overall system many times over.

Soldered, silver- or copper-sintered connections with correspondingly high thermal conductivities represent a game changer in terms of heat dissipation compared to the typically used polymer thermal interface materials (TIM).

Process and Product Development


Soldering materials to create solid-state  bonds is a technique that dates back thousands of years. Even today, soldering is the most popular means of interconnecting electronic components.  

Process and Product Development

Silver sintering

The demands on electronic and mechatronic systems are increasing steadily. Today, such systems are even expected to operate reliably at temperatures of up to 300°C. Silver sintering is an ever more popular means of achieving this and represents an alternative to conventional solder processes in power electronics.


Key Research Areas

Ag sintering of large areas

Large-area silver sintering between metallized ceramic substrates and a transfer cooler is suitable for achieving the highest possible thermal conductivity while maintaining a long service life.  


Key Research Areas

Power module for Formula 1 with substrate water cooling

Main goals for a Formula 1 power module are highest power density and lowest weight. Volume and weight of presented converter could be reduced by roughly 50 percent compared to previous versions.




Silicon carbide semiconductors, packaged for high-temperature applications, have the potential to increase switching frequencies and output substantially in future power electronics, while making them less susceptible to failure.