Process and Product Development

Optoelectronics

SIIT Photonic System Integration Verbindungstechnologien für optische Systeme Optoelektronik
© Fraunhofer IZM
Zeilenlaser aus 23 Einzelchips mit insgesamt mehr als 50.000 VCSELn
SIIT Photonic System Integration Verbindungstechnologien für optische Systeme Optoelektronik
© Fraunhofer IZM

Depending on the field of use optoelectronic components have very different requirements. Datacom lasers und photodiodes need to be single mode compatible and the accuracy of the assembly must be better than one micrometre to fulfil today’s requirements for data rates.

Components for optical measurement systems normally don’t need the high accuracy but the characteristics should be stable under different environmental conditions.
Most requirements for solid state lighting, like high power density, are almost fulfilled, but a wide field of special lighting applications is yet not addressed satisfactory.

High powers lasers are more cost intensive and have to realize the highest possible power density. To do this the heat has to be transferred into a liquid coolant taking care on all thermal expansion coefficient along the thermal path.

To solve all this different challenges various technologies were developed or improved at IZM (see below). Fluxless soldering with SnAg and AuSn, sintering with and without pressure with silver but also other metals experimentally, thermo compression bonding are some examples. For high accurate assemblies thermode soldering or reflow soldering with self-alignment are suitable technologies. Several small batch ovens are used for process development with specific gases, plasma or mechanical activation. For high volume processes production like inline reflow ovens and vapour phase ovens for condensation soldering are available.

More information

Process and Product Development

Soldering

Soldering materials to create solid-state bonds is a technique that dates back thousands of years. Even today, soldering is the most popular means of interconnecting electronic components.

Process and Product Development

Silver Sintering

The demands on electronic and mechatronic systems are increasing steadily. Today, such systems are even expected to operate reliably at temperatures of up to 300°C.

Process and Product Development

Chip on Board

COB (chip on board) technology is often successfully applied, when bare dies must be mounted on PC boards and/or in order to achieve a higher degree of integration of either electronic circuits or microsystems.

Process and Product Development

Wire Bonding

Qualification of surfaces with regard to bondability (bond testing), assembly of prototypes and small series, feasibility studies, process development, technological advice, schoolings.

Key Research Areas

Photonic Packaging